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Glass shaping technologies
Applications:
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IR cut-off filters for mobile, tablet PC and CCTV camera devices
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Semiconductor processing for MEMS, CMOS image sensors, advanced packaging and LEDs
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Flat panel digital x-ray detectors
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Electro chromatic windows and mirrors
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Substrates for active matrix flat panel displays
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Carrier for semiconductor processing
Glass ultra slimming
25μm(3gen) flexible Glass
5G(1100x1300mm) glass
slimmed 0.7t to 0.17t
Flexible, bendable, foldable
15μm(1gen) extreme Ultra Thinned - Glass
Glass cavity & Encap
Patterning for encapsulation
2G Glass slimming 0.6t to 0.1t
Encapsulation Glass
Deep cavities & glass cutting by chemical
Glass Cavity ( Glass THK : 0.55mm / Etching Depth : 0.34mm
Ultra Thin glass wafer cutting by chemical
Through glass via (TGV) technology
Patterning for TGVs
Through glass via holes Ø 200um
Glass Thickness: 50um Via Hole :Ø 50um (E2K corning glass)
Through glass via holes Ø 100um
Micro fine patterning for mobile phone cover glass
Line width : 30,50,70㎛ = 0.03,0.05,0.07mm
Line width : 30,50,70㎛ = 0.02,0.03,0.05mm
Glass decoration imaging
Applications : Glass parts decoration furniture, partition etc.
Precision micro patterning glass for decoration
Glass diffusion texturing
Textured glass surface
(pyramid structure)
Application : LED Lighting diffusing cover glass
Cover glass nano texturing for AR
Through glass via holes Ø 200um
Through glass via holes Ø 200um
Through glass via holes Ø 200um
Cover glass Slimming & Healing
cover glass with cassette
Healing & slimming
Before healing
After healing
Degine of glass slimming & healing equipment
Lay-out of glass slimming line
over flow with special module
cover glass healing/slimming/patterning
5G glass slimming equipment
