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Fine chemicals & consulting

SkpChem

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크롬, 데스크탑에서 최적화됨

wafer and chip extreme thinning technologies

Ultra-thin wafers have various industrial uses such as packaging application (Memory ,TSV,

interposers, WLP, LEDs, power device, CMOS Image sensor, MEMS RF Devices, and RF device.

◀◀ New Si Etchant Read More

Wafer extreme thinning

본 사이트는 데스크탑에 최적화되어있습니다!!

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Ultra-thinned device wafer

▷ 150um ground 8 inch CMOS wafer thin

down to 10um

More details to PDF

⊙ Wafer ultra thinning

⊙ Wafer damage relief

⊙ Thin wafer structuring

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12" Ultra-Thinned wafer THK : 15um

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8" Ultra-Thinned wafer thickness : 10um

SkpChem Research & Developement

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Flexibility of Ultra thinned patterned wafer

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Transmission of thickness : 10um

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NAND flash memory Transmission of 6 ㎛t

Enlarged image

Wafer Ultra thinning equipment

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Single wafer thinning equipment

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Barrel wafer thinning equipment

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Dip wafer thinning equipment

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#2,000 grit back side ground wafer

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bare wafer Vs thinned wafer

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textured surface of back side

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Mirror surface of back side

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Various surface roughness

Bendable chips

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Flexible device

▷25um nand flash memory device chip

More details to PDF

After etching ▷ No Warpage

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Flexible wafer : 8um

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Before thinning: 50㎛t

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After thinning:6 ㎛t

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Extreme thinned chip Thickness : 6 ㎛t

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Bendable chip : 5x5mm , 6㎛t

Light transmission

Mechanical (SSD) damage relief

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change to smooth edge

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mirror surface and wheel mark removed by chemical polishing

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improved die strength & uniformity

Micro Sensor

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fthin film flexible micro sensor

▷Damage free ultra-thin flexible device film enables pick-up and transfer

More details to PDF

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▷Thin-film device (Micro-Sensor) Manufacturing Technology

This work presents a novel method entitled “device transfer by backside etching (DTBE)” for transferring thin-film devices from Si wafers to a glass or plastic substrate. First, high performance poly-Si thin-film transistors (TFTs) were fabricated on a Si wafer and then adhered to UV tape substrates. The remaining Si was removed delicately using wafer backside grinding and wet chemical etching.

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Micro sensor on the UV tape

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Line width : 20~40um / thickness 20um , method : dip etching

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